Epoxy Resin For Potting At Cryogenic Temperatures

Master Bond EP30FLAO is a two-component epoxy resin system for high-performance potting, bonding, sealing and coating in demanding thermal management applications at cryogenic temperatures.

The low-viscosity epoxy is said to have excellent flow characteristics, making it ideal as a thermally conductive potting compound.

It is widely used in the electronic, electrical, computer, metalworking, appliance and chemical industries where electrical insulation, environmental protection and heat transfer is required.

EP30FLAO features a service temperature range of 4K to 250F, thermal conductivity of 9-10 BTU/in/ft/hr/F and viscosity of 5,000 to 6,000cps at 75F.

In addition, it has a low thermal-expansion coefficient, dimensional stability, and high physical strength and toughness.

Parts A and B are available in half pint, pint, quart, one gallon and five gallon containers.

SOURCE: Master Bond